The mixing technology of threading through-hole insertion (THT) and surface mounting (SMT) coexists, which is the most common assembling method in the production of electronic products. In the whole production process, one of the components of printed circuit board (PCB) is cured by dispensing from the beginning. Wave soldering can only be carried out at the end, and the interval between them is long. And there are many other processes, the curing of components is particularly important, so it is of great significance for the research and analysis of dispensing process.
The glue used in SMT is mainly used in the wave soldering process of surface mounted devices such as chip components, SOT, SOIC, etc. The purpose of fixing surface mounted components on PCB with glue is to avoid the possible dropping or shifting of components under the impact of high temperature wave crest. In general, epoxy resin heat curing glue is used in production instead of propionic acid glue. (Printed Circuit Board Assembly)
Our Company is UL,ISO9001,ROHS and GJB9001B certified.
Packing and Shipping:
1. How to Get a quotation?
For PCBs,pls send us the Gerber File.For PCBA,pls send us the Gerber file and BOM(Bill of Materials)
2. What is the MOQ?
No MOQ.1 pcs is ok.
3.What is the lead time?
For PCB orders,the lead time is 2 to 10 days.For PCBA orders,the lead time will be 15 to 30 days.
4.Will the boards be tested before shippment?
Yes,all PCBs will be tested by Flying Probe or E-test.For PCBA,we will have AOI,X-ray,and functional test