Multilayers Rigid Motherboard PCB Prototype

Multilayers Rigid Motherboard PCB Prototype

Min solder mask bridge:0.08mm
Aspect raion: 15:1
Plugging vias capability:0.2-0.8mm
Impedance Control Tolerance:±10%
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Product Details

Our company is a modern enterprise, producing pcb and assembly, Pcb Maker, Electronic Board Assembly in many countries and regions and industrial globalization has been our strategic direction. We adhere to the business philosophy of 'taking the market as the basis for development, and regarding product quality as the life of the enterprise', continue to develop and innovate, and gradually form specialization, serialization and scale production of products. We uphold and carry forward the spirit of daring to be the first in the world to explore the development of the industry with revolutionary and leaping innovative ideas. And It is our great pleasure if you like to have a personally meeting in our office.

PCB Knowledge:


HASL is the leading surface treatment process used in industry. The process is formed by immersing the circuit board into lead-tin alloy, and the excess solder is removed by the "wind knife", which is the hot air blowing on the surface of the board. For the PCA process, HASL has many advantages: it is the cheapest PCB, and the surface layer can be soldered after multiple reflow soldering, cleaning and storage.

For ICT, HASL also provides an automatic solder covering test pad and perforation process. However, compared with the existing alternative methods, HASL surface flatness or coplanar is very poor. Now there are some lead-free HASL substitution processes, which are becoming more and more popular because of the natural substitution characteristics of HASL. Over the years, HASL has worked well.But with "environmental protection," green process requirements, the existence of this process is numbered. In addition to lead-free problems, increasing board complexity and finer spacing have exposed many of the limitations of the HASL process.

Advantages: minimum cost PCB surface process, maintain solderability throughout the manufacturing process, no negative impact on ICT.

Disadvantages: lead-containing processes are commonly used and are now restricted . it will eventually be eliminated by 2007. In the case of fine pin spacing (< 0.64mm), the bridging and thickness of solder may be caused. Uneven surfaces can lead to homoplanar problems in the assembly process.

(Pcb Prototype)


Process of pcb manufacturing:

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PCB Equipment:

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Certifications:

Our Company is UL,ISO9001,ROHS and GJB9001B certified. 

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Packing and Shipping:

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FAQ:

1. How to Get a quotation?

For PCBs,pls send us the Gerber File.For PCBA,pls send us the Gerber file and BOM(Bill of Materials)

2. What is the MOQ?

No MOQ.1 pcs is ok.

3.What is the lead time?

For PCB orders,the lead time is 2 to 10 days.For PCBA orders,the lead time will be 15 to 30 days.

4.Will the boards be tested before shippment?

Yes,all PCBs will be tested by Flying Probe or E-test.For PCBA,we will have AOI,X-ray,and functional test

 


We investigate the production of Multilayers Rigid Motherboard PCB Prototype, and take advantage of the strengths of many other manufacturers to innovate it continuously. At present, the products have been exported to many other countries. Our company takes technological progress as the means, investment as the support, talents as the foundation, speeds up the technological innovation system, vigorously implements the high-tech industrialization and strives to enhance the quality competitiveness of enterprises.
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