The meridional and latitudinal shrinkage of semi-cured laminates after lamination is different. The meridional and zonal shrinkage must be distinguished when laying-off and lamination. Otherwise, it is easy to warp the finished PCB after lamination, and the pressure baking board is difficult to correct. Many of the causes of multilayer warpage are due to the misunderstanding of meridional and latitudinal.
The multilayer board is removed after hot and cold pressing, cut or milled off the edges, and then laid flat in the oven for 150 degrees Celsius for 4 hours, so that the stress in the plate is gradually released, and the resin is cured completely. This step must not be omitted.
Special clamping rollers should be made when 0.4~0.6mm ultra-thin multilayer board is used for plate plating and graphic electroplating. It is to straighten out all the boards on the roll. The board after plating will not deform. Without this measure, the thin plate would bend after electroplating 20 or 30 microns of copper, and it would be difficult to remedy.( printed wiring board)
Process of pcb manufacturing:
Our Company is UL,ISO9001,ROHS and GJB9001B certified.
Packing and Shipping:
1. How to Get a quotation?
For PCBs,pls send us the Gerber File.For PCBA,pls send us the Gerber file and BOM(Bill of Materials)
2. What is the MOQ?
No MOQ.1 pcs is ok.
3.What is the lead time?
For PCB orders,the lead time is 2 to 10 days.For PCBA orders,the lead time will be 15 to 30 days.
4.Will the boards be tested before shippment?
Yes,all PCBs will be tested by Flying Probe or E-test.For PCBA,we will have AOI,X-ray,and functional test
Email us to get a quote: email@example.com