PCB Printed Circuit Board

Min annular ring: 4 mil
Max copper thickness:12oz
Max size for multi-layers PCBs: 500 x 1200mm
Min solder mask bridge:0.08mm
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Product Details

PCB Knowledge:

Organic solder protectant (OSP) is used to create a thin, uniform protective layer on the copper surface of PCB. This coating protects the circuit from oxidation during storage and assembly operations. This process has been around for a long time, but only recently it becomes popular with the search for lead-free technologies and fine spacing solutions.


In terms of homoplanar and solderability, OSP has better performance than HASL in PCA assembly.But the type of flux and the number of thermal cycles need to be changed greatly. Because its acidic properties reduce OSP performance and make copper oxidized easily.It needs careful treatment. Assemblers prefer to handle metal surfaces which is more flexible and able to withstand more 

Thermal cycle period.


Using OSP surface treatment, if the test point is not welded, it will lead to the contact problem of the needle clamp in ICT. Simply changing to a sharper probe type through the OSP layer will only lead to damage and puncture of PCA test holes or test pads. It has been shown that switching to a higher probe force or changing the probe type has little effect on the yield.


Untreated copper has a yield strength of one order of magnitude higher than that of lead soldering.The result is to damage exposed copper test pads. All testability guidelines strongly recommend no direct detection of exposed copper. When using OSP, you need to define a set of OSP rules for the ICT phase. The most important rule requires that the plate film (Stencil) be opened at the beginning of the PCB process . Allowing solder paste is added to test pads and holes.

Advantages: comparable with HASL in unit cost, good coplanar, lead-free process, improved solderability.

Disadvantages: the assembly process needs to be changed greatly, if the detection of unmachined copper surface will be detrimental to the ICT, ICT probe over the tip of the PCB, may damage the PCB and requires manual handling, limiting ICT testing and reducing the repeatability of the test.(pcb printed circuit board)

Process of pcb manufacturing:


PCB Equipment:





Our Company is UL,ISO9001,ROHS and GJB9001B certified. 


Packing and Shipping:




1. How to Get a quotation?

For PCBs,pls send us the Gerber File.For PCBA,pls send us the Gerber file and BOM(Bill of Materials)

2. What is the MOQ?

No MOQ.1 pcs is ok.

3.What is the lead time?

For PCB orders,the lead time is 2 to 10 days.For PCBA orders,the lead time will be 15 to 30 days.

4.Will the boards be tested before shippment?

Yes,all PCBs will be tested by Flying Probe or E-test.For PCBA,we will have AOI,X-ray,and functional test


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