The multilayer PCB circuit board is usually made of epoxy glass cloth coated copper foil laminates. The manufacturing process is developed on the basis of coated holes on double sided boards. The process is to etch the pattern of the inner laminate. After black oxide, the semi-solidified sheet is added to the predetermined design for lamination. Then it should put a piece of copper foil on the upper and lower surface. The press is heated and pressurized. "Double sided copper clad board" has been prepared, and then the NC drilling is carried out according to the pre-designed positioning system. After drilling, the hole wall should be treated with concave erosion and decontamination, and then it can be carried out according to the technology of double sided coated hole printed circuit board.
Compared with the conventional multilayer and double sided board production process, the multilayer board adds several unique process steps. In most of the processes, some process parameters, equipment accuracy and complexity are different. For example, the metallization connection of the inner layer of the multilayer is the decisive factor. The quality requirement of the hole wall is more strict than that of the double sided board, so the requirement for drilling is even higher. (4 layer pcb)
Process of pcb manufacturing:
Our Company is UL,ISO9001,ROHS and GJB9001B certified.
Packing and Shipping:
1. How to Get a quotation?
For PCBs,pls send us the Gerber File.For PCBA,pls send us the Gerber file and BOM(Bill of Materials)
2. What is the MOQ?
No MOQ.1 pcs is ok.
3.What is the lead time?
For PCB orders,the lead time is 2 to 10 days.For PCBA orders,the lead time will be 15 to 30 days.
4.Will the boards be tested before shippment?
Yes,all PCBs will be tested by Flying Probe or E-test.For PCBA,we will have AOI,X-ray,and functional test
Email us to get a quote: firstname.lastname@example.org