Multiple substrates are made of two or more circuits stacked together with reliable predefined connections. Since drilling and electroplating have been completed before all the layers are rolled together, the technique has violated the traditional fabrication process from the outset. The innermost layers are made up of traditional double layers boards, and the outer layers are made up of separate single sided boards. Before rolling, the inner substrate will be drilled, perforated, patterned, developed, and etched. The outer layer of the borehole is signalling layer. It is plated through by forming a copper ring on the inside edge of the through hole. The layers are rolled together to form multiple substrates, it can be connected by wave soldering.
Rolling may be done in hydraulic presses or in excess pressure tanks. In a hydraulic press, the prepared material is placed under cold or preheated pressure (material with high glass conversion temperature is placed at a temperature of 170-180 ℃). The glass transition temperature is the amorphous region of an amorphous polymer (resin) or part of a crystalline polymer. It changes from hard brittle state to viscous rubber state.(express pcb)
Process of pcb manufacturing:
Our Company is UL,ISO9001,ROHS and GJB9001B certified.
Packing and Shipping:
1. How to Get a quotation?
For PCBs,pls send us the Gerber File.For PCBA,pls send us the Gerber file and BOM(Bill of Materials)
2. What is the MOQ?
No MOQ.1 pcs is ok.
3.What is the lead time?
For PCB orders,the lead time is 2 to 10 days.For PCBA orders,the lead time will be 15 to 30 days.
4.Will the boards be tested before shippment?
Yes,all PCBs will be tested by Flying Probe or E-test.For PCBA,we will have AOI,X-ray,and functional test
Email us to get a quote: firstname.lastname@example.org