The circuits area of the outer A and B surfaces should be as close as possible. If the A surface is a large copper surface and the B surface is only a few circuits, the printed circuit board is easily warped after etching. If the circuits area differs a lot in the 2 sides, a few separate grids can be added to the thin side to balance.
The purpose of baking board (150 degrees Celsius, 8 ±2 hours) is to remove the moisture in the board. At the same time, the resin in the board can be cured completely, and the residual stress in the board can be further eliminated, which is helpful to prevent the warpage of the plate. At present, many double sided, multilayer boards still adhere to the pre-or post-drying process. However, there are some exceptions to the factory. At present, the drying time of each PCB factory is inconsistent, from 4 to 10 hours. It is suggested to decide according to the grade of the PCB produced and the requirements of the customer for warpage. Bake after panel or laying-off after baking,the two methods are feasible. It is suggested that the board should be dried after shearing. Inner laminates should also be baked.( eagle pcb)
Process of pcb manufacturing:
Our Company is UL,ISO9001,ROHS and GJB9001B certified.
Packing and Shipping:
1. How to Get a quotation?
For PCBs,pls send us the Gerber File.For PCBA,pls send us the Gerber file and BOM(Bill of Materials)
2. What is the MOQ?
No MOQ.1 pcs is ok.
3.What is the lead time?
For PCB orders,the lead time is 2 to 10 days.For PCBA orders,the lead time will be 15 to 30 days.
4.Will the boards be tested before shippment?
Yes,all PCBs will be tested by Flying Probe or E-test.For PCBA,we will have AOI,X-ray,and functional test
Email us to get a quote: email@example.com