Cheap Pcb Manufacturing

It should open the PCB diagram on the computer, light up the short-circuit network, and see where the nearest place is most easily connected. Special attention should be paid to the IC internal short circuit.
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Product Details

PCB Knowledge:

Prevent warpage of multilayer PCB boards during processing


1. Prevent the substrate from being warped due to improper inventory

(1) Due to the increase in warpage of the copper clad laminate during storage, the moisture absorption area of the single-sided copper clad laminate is large. If the inventory environment humidity is high, the single-sided copper clad laminate will significantly increase the warpage. The moisture of the double-sided copper clad plate can only penetrate from the end face of the product, the moisture absorption area is small, and the warpage changes slowly. Therefore, for the copper clad laminate without moisture-proof packaging, pay attention to the warehouse conditions, minimize the humidity of the warehouse and avoid the bare copper clad plate to avoid the warpage of the copper clad laminate during storage.

2) Improper placement of copper clad laminates will increase warpage. If the vertical or copper clad plate is pressed with heavy objects, poor placement, etc. will increase the copper plate warpage deformation.

Avoid warpage caused by improper design of printed circuit board or improper processing.

For example, the PCB conductive circuit pattern is unbalanced or the PCB board is obviously asymmetrical on both sides. On one side, there is a large area of copper foil, which forms a large stress, which causes the PCB board to warp. The processing temperature is high or large thermal shock in the PCB process will cause the PCB to warp. For the impact of improper boarding stocks, the PCB factory is better able to solve the problem, improve the storage environment and eliminate vertical and avoid heavy pressure. For PCB boards with a large area of copper, it is best to mesh the copper foil to reduce stress.( cheap pcb manufacturing)

Process of pcb manufacturing:


PCB Capability:

Max layers number:

40 layers

Min line width/gap:


Min hole size for mechanical drill:


Min hole size for laser drill:


Min annular ring:

4 mil

Max copper thickness:


Max size for single and double layers PCBs:

600 x 1200mm

Max size for multi-layers PCBs:

500 x 1200mm

Board thickness for 2 layers:


Board thickness for multi-layers:


Min solder mask bridge:


Aspect raion:


Plugging vias capability:


Impedance Control Tolerance:

±10%(±5% for PCB Prototypes)

Thickness tolerance for PTH:

+/- 3mil

Thickness tolerance for NPTH:

+/- 2mil

Solder mask color:

White, black, blue, green, yellow, red and so on



Finished surface:

OSP(Entek), HASL no lead free, HASL Lead Free, ENIG(Immersion Gold), Immersion Tin, Immersion Silver, Hard Gold, Platting Gold, Gold Finger, Enepig.

Month capability:

6000 types/month,

30000 square meters/month

Normal board materials:


Special materials:


Our Factory:





Our Company is UL,ISO9001,ROHS and GJB9001B certified. 


Packing and Shipping:




1. How to Get a quotation?

For PCBs,pls send us the Gerber File.For PCBA,pls send us the Gerber file and BOM(Bill of Materials)

2. What is the MOQ?

No MOQ.1 pcs is ok.

3.What is the lead time?

For PCB orders,the lead time is 2 to 10 days.For PCBA orders,the lead time will be 15 to 30 days.

4.Will the boards be tested before shippment?

Yes,all PCBs will be tested by Flying Probe or E-test.For PCBA,we will have AOI,X-ray,and functional test

Email us to get a quote:


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