The high-speed signal transmission layer in the circuit should be the middle layer of the signal and between the two internal electrical layers. The copper film of the two inner electric layers can provide electromagnetic shielding for high speed signal transmission. It can effectively limit the radiation of the high speed signal between the two inner electric layers without interference.
It avoids proximity of two signal layers. It is easy to introduce crosstalk between adjacent signal layers, which leads to the failure of circuit function, and the addition of ground plane between two signal layers can effectively avoid crosstalk.
A plurality of grounded inner layers can effectively reduce the grounding impedance; For example, the A signal layer and the B signal layer can effectively reduce the common-mode interference by using separate ground planes.
It can be densification. For decades, PCB high density has developed with the development of integrated circuit integration and installation technology.( cheap pcb fabrication)
Process of pcb manufacturing:
Our Company is UL,ISO9001,ROHS and GJB9001B certified.
Packing and Shipping:
1. How to Get a quotation?
For PCBs,pls send us the Gerber File.For PCBA,pls send us the Gerber file and BOM(Bill of Materials)
2. What is the MOQ?
No MOQ.1 pcs is ok.
3.What is the lead time?
For PCB orders,the lead time is 2 to 10 days.For PCBA orders,the lead time will be 15 to 30 days.
4.Will the boards be tested before shippment?
Yes,all PCBs will be tested by Flying Probe or E-test.For PCBA,we will have AOI,X-ray,and functional test
Email us to get a quote: firstname.lastname@example.org