The shrinkage of PCB is that the copper clad board is drilled in the PCB process. As a result of heating, the hole drilled out caused shrinkage and the hole was smaller than the drill bit.
The main reason for the shrinkage is the incomplete curing of the substrate, and hole shrinkage caused by repeated heating in PCB. It is often encountered in the application of the insulating board. As shrinkage affects the assembly of subsequent electronic components, it is necessary to prevent the substrate from curing incompletely, which results in the phenomenon of shrinkage in PCB process. After receiving complaints from users about the problem, it can be solved by improving the curing degree of the substrate.
Because the thickness of copper clad laminate is thin, the inclined hole is not easy to be observed, so the inclined hole mainly appears on the thicker insulating board. During drilling, the bit is not perpendicular to the substrate, but it slants through the substrate, and it seriously affects the use of the product. The reason is that the substrate is not cured completely.(board printing)
Process of pcb manufacturing:
Our Company is UL,ISO9001,ROHS and GJB9001B certified.
Packing and Shipping:
1. How to Get a quotation?
For PCBs,pls send us the Gerber File.For PCBA,pls send us the Gerber file and BOM(Bill of Materials)
2. What is the MOQ?
No MOQ.1 pcs is ok.
3.What is the lead time?
For PCB orders,the lead time is 2 to 10 days.For PCBA orders,the lead time will be 15 to 30 days.
4.Will the boards be tested before shippment?
Yes,all PCBs will be tested by Flying Probe or E-test.For PCBA,we will have AOI,X-ray,and functional test
Email us to get a quote: firstname.lastname@example.org