The temperature-sensitive components are best placed in the lowest temperature area (such as the bottom of the device). Do not place it directly above the heat-generating components. Multiple components are preferably staggered on a horizontal plane.
The heat dissipation of PCB mainly depends on the air flow, so the air flow path should be studied during the design, and the components should be reasonably configured. When air flows, it tends to flow in a place with low resistance, so when configuring the components on the printed circuit board, avoid leaving a large airspace in a certain area.
Avoid the concentration of hot spots on the PCB, and distribute the power as evenly as possible on the PCB to maintain uniform and consistent temperature performance on the PCB surface. It is more difficult to achieve strict uniform distribution during the design process, but it is necessary to avoid areas with too high power density to avoid excessive hot spots that affect the normal operation of the entire circuit. If possible, it is necessary to analyze the thermal efficiency of printed circuits. For example, some professional PCB design software can help designers optimize circuit design.
Welcome to use pcb prototype and assembly services from Linke Electronics.
Our Factory Show:
Our Company is UL,ISO9001,ROHS and GJB9001B certified.
Packing and Shipping:
1. How to Get a quotation?
For PCBs,please send us the Gerber File.For PCBA,please send us the Gerber file and BOM(Bill of Materials)
2. What is the MOQ?
No MOQ.1 pcs is ok.
3.What is the lead time?
For PCB orders,the lead time is 2 to 10 days.For PCBA orders,the lead time will be 15 to 30 days.
4.Will the boards be tested before shippment?
Yes,all PCBs will be tested by Flying Probe or E-test.For PCBA,we will have AOI,X-ray,and functional test
Email us to get a quote: email@example.com