PCB Fabrication and Assembly

Surface mounting technology, referred to as SMT, as a new generation of electronic assembly technology, it has penetrated into various fields. SMT products have compact structure, small size, vibration resistance, shock resistance , high frequency characteristics ,high production efficiency and so on. SMT in the circuit board assembly process has occupied a leading position.
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Product Details

PCBA Knowledge:

Surface mounting technology, referred to as SMT, as a new generation of electronic mounting technology has penetrated into various fields. SMT products have the advantages of compact structure, small size, vibration resistance, impact resistance, high frequency characteristics and high production efficiency. SMT has occupied a leading position in circuit board assembly technology.

Typical surface mounting process is divided into three steps: applying solder paste - mounting components - reflow soldering

The appropriate amount of solder paste is evenly applied to the PCB pad to ensure that the pad corresponding to the patch components and PCB achieves good electrical connection and sufficient mechanical strength during reflow soldering. The solder paste is a paste with certain viscosity and good contact property, which is made up of alloy powder, paste flux and some additives.

At room temperature, because the paste has a certain viscosity, electronic components can be pasted on the PCB pad. When the inclination angle is not too large and there is no external force collision, the general components will not move. When the solder paste is heated to a certain temperature, the alloy powder in the solder paste melts and flows again. The solder pins of components and PCB pad are infiltrated by Liquid solder. After cooling, the solder end of the component is connected with the pad by solder, forming the solder joint of electrical and mechanical connection.


Welcome to use our Pcb Fabrication And Assembly service of Linke Electronics.

 

PCBA Process:

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PCBA Capability:

One-stop PCBA

PCB,Components sourcing,Assembly,Module Assembly

Minimum Order Quantity

1 piece

PCB Size

5mm×5mm(Minimum)

1200×600mm(Maximum)

PCB Thickness

0.2mm(Minimum)

7.0mm(Maximum)

SMT Position accuracy

0.02mm

Minimum IC Pitch

0.3mm

Minimum BGA Pitch

0.3mm

Maximum BGA Size

74mm×74mm

Solder Type

Lead Free(ROHS compliant)

NO Lead Free

Components Type

Passive components down to 01005 QFN, BGA, SOP, PLCC, SOIC, POP and etc

Type of assembly

SMT,Through Hole,Cable Assembly,Wire Harness,Module Assembly

Files needed

Gerber File(CAM,PCB,PCBDOC format)

BOM(Bill of Material)

Pick and Place file

Components Purchasing

Turnkey(We supply all the parts)

Consigned(Customers supply the parts)

Customers supply some parts,we purchase the rest

Test

AOI,X-ray,In-Circuit Test (ICT), Functional Test (FCT)

 

PCBA Equipment:

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Certifications:

Our Company is UL,ISO9001,ROHS and GJB9001B certified. 

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Packing and Shipping:

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2

FAQ:

1. How to Get a quotation?

For PCBs,pls send us the Gerber File.For PCBA,pls send us the Gerber file and BOM(Bill of Materials)

2. What is the MOQ?

No MOQ.1 pcs is ok.

3.What is the lead time?

For PCB orders,the lead time is 2 to 10 days.For PCBA orders,the lead time will be 15 to 30 days.

4.Will the boards be tested before shippment?

Yes,all PCBs will be tested by Flying Probe or E-test.For PCBA,we will have AOI,X-ray,and functional test

 


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