PCBA Knowledge:
Surface mounting technology, referred to as SMT, as a new generation of electronic mounting technology has penetrated into various fields. SMT products have the advantages of compact structure, small size, vibration resistance, impact resistance, high frequency characteristics and high production efficiency. SMT has occupied a leading position in circuit board assembly technology.
Typical surface mounting process is divided into three steps: applying solder paste - mounting components - reflow soldering
The appropriate amount of solder paste is evenly applied to the PCB pad to ensure that the pad corresponding to the patch components and PCB achieves good electrical connection and sufficient mechanical strength during reflow soldering. The solder paste is a paste with certain viscosity and good contact property, which is made up of alloy powder, paste flux and some additives.
At room temperature, because the paste has a certain viscosity, electronic components can be pasted on the PCB pad. When the inclination angle is not too large and there is no external force collision, the general components will not move. When the solder paste is heated to a certain temperature, the alloy powder in the solder paste melts and flows again. The solder pins of components and PCB pad are infiltrated by Liquid solder. After cooling, the solder end of the component is connected with the pad by solder, forming the solder joint of electrical and mechanical connection.
Welcome to use our Pcb Fabrication And Assembly service of Linke Electronics.
PCBA Process:
PCBA Capability:
One-stop PCBA | PCB,Components sourcing,Assembly,Module Assembly |
Minimum Order Quantity | 1 piece |
PCB Size | 5mm×5mm(Minimum) 1200×600mm(Maximum) |
PCB Thickness | 0.2mm(Minimum) 7.0mm(Maximum) |
SMT Position accuracy | 0.02mm |
Minimum IC Pitch | 0.3mm |
Minimum BGA Pitch | 0.3mm |
Maximum BGA Size | 74mm×74mm |
Solder Type | Lead Free(ROHS compliant) NO Lead Free |
Components Type | Passive components down to 01005 QFN, BGA, SOP, PLCC, SOIC, POP and etc |
Type of assembly | SMT,Through Hole,Cable Assembly,Wire Harness,Module Assembly |
Files needed | Gerber File(CAM,PCB,PCBDOC format) BOM(Bill of Material) Pick and Place file |
Components Purchasing | Turnkey(We supply all the parts) Consigned(Customers supply the parts) Customers supply some parts,we purchase the rest |
Test | AOI,X-ray,In-Circuit Test (ICT), Functional Test (FCT) |
PCBA Equipment:
Certifications:
Our Company is UL,ISO9001,ROHS and GJB9001B certified.
Packing and Shipping:
FAQ:
1. How to Get a quotation?
For PCBs,pls send us the Gerber File.For PCBA,pls send us the Gerber file and BOM(Bill of Materials)
2. What is the MOQ?
No MOQ.1 pcs is ok.
3.What is the lead time?
For PCB orders,the lead time is 2 to 10 days.For PCBA orders,the lead time will be 15 to 30 days.
4.Will the boards be tested before shippment?
Yes,all PCBs will be tested by Flying Probe or E-test.For PCBA,we will have AOI,X-ray,and functional test
