The components on the same PCB should be arranged as much as possible according to the amount of heat generated and the degree of heat dissipation. Components with low heat generation or poor heat resistance (such as small signal transistors, small-scale integrated circuits, electrolytic capacitors, etc.) should be placed in the most Upstream (at the entrance), components with high heat generation or good heat resistance (such as power transistors, large-scale integrated circuits, etc.) are placed at the most downstream of the cooling airflow.
In the horizontal direction, high-power components should be arranged as close to the edge of the printed PCB board as possible to shorten the heat transfer path;In the vertical direction, high-power components are placed as close to the top side of the PCB board as possible to reduce the impact of these components on the temperature of other components.
Welcome to use pcb contract assembly services from Linke Electronics.
Our Factory Show:
Our Company is UL,ISO9001,ROHS and GJB9001B certified.
Packing and Shipping:
1. How to Get a quotation?
For PCBs,please send us the Gerber File.For PCBA,please send us the Gerber file and BOM(Bill of Materials)
2. What is the MOQ?
No MOQ.1 pcs is ok.
3.What is the lead time?
For PCB orders,the lead time is 2 to 10 days.For PCBA orders,the lead time will be 15 to 30 days.
4.Will the boards be tested before shippment?
Yes,all PCBs will be tested by Flying Probe or E-test.For PCBA,we will have AOI,X-ray,and functional test
Email us to get a quote: email@example.com