Pcb Components Assembly

Minimum IC Pitch:0.3mm Minimum BGA Pitch:0.3mm Maximum BGA Size:74mm×74mm Minimum Order Quantity:1 piece
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Product Details

PCBA Knowledge:

When designing a PCB board,place the components with the highest power consumption and heat generation near the best heat dissipation location. Do not place components with high heat generation at the corners and peripheral edges of the printed PCB board, unless a heat sink is arranged near it.


High heat dissipation components should minimize the thermal resistance between them when connected to the PCB board. In order to better meet the thermal characteristics requirements, some thermally conductive materials (such as a layer of thermally conductive silicone) can be used on the bottom surface of the chip, and a certain contact area is maintained for the components to dissipate heat.


Welcome to use pcb components assembly services from Linke Electronics.


PCBA Process:

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Our Factory Show:


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Our Company is UL,ISO9001,ROHS and GJB9001B certified. 


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Packing and Shipping:


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1. How to Get a quotation?

For PCBs,please send us the Gerber File.For PCBA,please send us the Gerber file and BOM(Bill of Materials)

2. What is the MOQ?

No MOQ.1 pcs is ok.

3.What is the lead time?

For PCB orders,the lead time is 2 to 10 days.For PCBA orders,the lead time will be 15 to 30 days.

4.Will the boards be tested before shippment?

Yes,all PCBs will be tested by Flying Probe or E-test.For PCBA,we will have AOI,X-ray,and functional test

Email us to get a quote: admin@brightcircuits.com



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