According to the properties of laminated material, some PCB (especially large and complicated thick circuit boards) may increase the failure rate of delamination, lamination rupture and, CAF (conduction anode wire failure) due to the high lead-free welding temperature of PCB. It also depends on the PCB surface coating. For example, it has been observed that the bonding between welding and Ni layer (from ENIG coating) is easier to fracture than between welding and Cu (such as OSP and silver immersion), especially under mechanical impact (such as drop test). In addition, in drop testing, PCB lead-free welding will occur more PCB rupture.
Some components, such as plastic encapsulated components, electrolytic capacitors, they are affected by higher welding temperature than other factors. Second, tin wire is another issue of greater concern for fine-spaced components in high-end products with long service lives. In addition, the high modulus of SAC alloy will also bring greater pressure to the components and bring problems to the components with low k dielectric coefficient, which are usually more vulnerable to failure.(Pcb Assy)
Our Company is UL,ISO9001,ROHS and GJB9001B certified.
Packing and Shipping:
1. How to Get a quotation?
For PCBs,pls send us the Gerber File.For PCBA,pls send us the Gerber file and BOM(Bill of Materials)
2. What is the MOQ?
No MOQ.1 pcs is ok.
3.What is the lead time?
For PCB orders,the lead time is 2 to 10 days.For PCBA orders,the lead time will be 15 to 30 days.
4.Will the boards be tested before shippment?
Yes,all PCBs will be tested by Flying Probe or E-test.For PCBA,we will have AOI,X-ray,and functional test