A recommended hand soldering procedure is to quickly contact the heated and tinned soldering iron tip with a cored wire and then contact the solder joint area to help the initial heat transfer from the soldering iron to the workpiece with the molten solder. Then remove the tin wire from the tip that will contact the soldered surface. Another procedure is to place the soldering iron tip on the pin/pad; place the tin wire between the soldering iron tip and the pin to form a thermal bridge; then quickly move the tin wire to the opposite side of the solder joint area. Any method, if done correctly, will give satisfactory results.
The purpose of these two techniques is to ensure that the temperature of the leads and pads is sufficient to melt the tin wires and form the desired intermetallic bond. If the soldering iron directly contacts and melts the tin wire during the formation of the solder joint, the surface to be soldered may not be hot enough to increase solder flow, and the resulting solder joint may not be wet to the pad or barrel and lead. When the process is implemented correctly, the flux will melt and flow on the surface to be soldered prior to the solder, pre-treating the surface so that the solder will wet and flow on the surface, into the gap, forming a bond. Once the wetting is established and there is sufficient solder flow to form the desired solder joint, the solder wire and subsequent soldering iron are removed from the solder joint area.
After training, practice, and relatively formal applications, these procedures are not too difficult for people with enthusiasm and experience to implement. Some people are faster than others, prefer it, and even the most experienced and intelligent operators will take a few days to master the process. For this reason, the operator should be provided with good initial training and regular updates. These aspects should include the art and construction of hand soldering, the factors that control the formation of solder joints, and the standards that corporate bodies use for solder joint acceptance and rejection.(Pcb Assembly Quote)
Our Company is UL,ISO9001,ROHS and GJB9001B certified.
Packing and Shipping:
1. How to Get a quotation?
For PCBs,pls send us the Gerber File.For PCBA,pls send us the Gerber file and BOM(Bill of Materials)
2. What is the MOQ?
No MOQ.1 pcs is ok.
3.What is the lead time?
For PCB orders,the lead time is 2 to 10 days.For PCBA orders,the lead time will be 15 to 30 days.
4.Will the boards be tested before shippment?
Yes,all PCBs will be tested by Flying Probe or E-test.For PCBA,we will have AOI,X-ray,and functional test