Electronic Manufacturing Services

SMC/SMD and THC can be mixed on the same side of PCB, and SMC/SMD can also be distributed on both sides of PCB. Double-sided PCB, double-wave soldering or reflow welding is used for two-sided hybrid assembly. In this kind of assembly, there is also the difference between the first and the latter SMC/SMD. Generally, according to the type of SMC/SMD and the size of PCB, the first paste method is usually used.
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Product Details

PCBA Knowledge:

The first type is single-sided hybrid assembly, that is, the SMC/SMD and the through-hole component are distributed on different sides of the PCB, but the soldering surface is only one side. This type of assembly uses a single-sided PCB and wave soldering process, specifically in two ways.

(1) First paste method. The first type of assembly is called the first paste method, that is, the SMC/SMD is placed on the B side (welding surface) of the PCB, and then the THC is inserted on the A side.

(2) Post-paste method. The second assembly method is called post-paste method. It is to insert THC on the A side of the PCB and then mount the SMD on the B side.

The second type is double-sided hybrid assembly. SMC/SMD and THC can be mixed and distributed on the same side of the PCB. At the same time, SMC/SMD can also be distributed on both sides of the PCB. Double-sided hybrid assembly uses double-sided PCB, dual wave soldering or reflow soldering. In this type of assembly method, there is also the difference between paste first SMC/SMD and paste after SMC/SMD. Generally, it is reasonably selected according to the type of SMC/SMD and the size of the PCB,the first paste method is usually used. (Electronic Manufacturing Services)


PCBA Capability:

One-stop PCBA

PCB,Components sourcing,Assembly,Module Assembly

Minimum Order Quantity

1 piece

PCB Size

5mm×5mm(Minimum)

1200×600mm(Maximum)

PCB Thickness

0.2mm(Minimum)

7.0mm(Maximum)

SMT Position accuracy

0.02mm

Minimum IC Pitch

0.3mm

Minimum BGA Pitch

0.3mm

Maximum BGA Size

74mm×74mm

Solder Type

Lead Free(ROHS compliant)

NO Lead Free

Components Type

Passive components down to 01005 QFN, BGA, SOP, PLCC, SOIC, POP and etc

Type of assembly

SMT,Through Hole,Cable Assembly,Wire Harness,Module Assembly

Files needed

Gerber File(CAM,PCB,PCBDOC format)

BOM(Bill of Material)

Pick and Place file

Components Purchasing

Turnkey(We supply all the parts)

Consigned(Customers supply the parts)

Customers supply some parts,we purchase the rest

Test

AOI,X-ray,In-Circuit Test (ICT), Functional Test (FCT)


Certifications:

Our Company is UL,ISO9001,ROHS and GJB9001B certified. 

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Packing and Shipping:

1

2

FAQ:

1. How to Get a quotation?

For PCBs,pls send us the Gerber File.For PCBA,pls send us the Gerber file and BOM(Bill of Materials)

2. What is the MOQ?

No MOQ.1 pcs is ok.

3.What is the lead time?

For PCB orders,the lead time is 2 to 10 days.For PCBA orders,the lead time will be 15 to 30 days.

4.Will the boards be tested before shippment?

Yes,all PCBs will be tested by Flying Probe or E-test.For PCBA,we will have AOI,X-ray,and functional test

 


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