Electronic Components Assembly

Minimum IC Pitch:0.3mm Minimum BGA Pitch:0.3mm Maximum BGA Size:74mm×74mm Minimum Order Quantity:1 piece
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Product Details

PCBA Knowledge:

When there are a few devices in the PCB that diverge and conduct (three consecutive), a heat sink or a conductive tube can be added to the heating components. When the temperature cannot be lowered, a radiator with a fan can be used to enhance the heat dissipation effect. When the amount of heat-generating components is more than 3, a large heat shield (board) can be used. It is a special heat sink customized according to the position and height of the PCB heat-generating components. The heat sink is integrated but the heat dissipation effect is not good due to the poor consistency of the height when the components are mounted and soldered. Generally, a soft thermal phase change attenuation pad is added on the surface of the component to improve the heat dissipation effect.


Welcome to use electronic components assembly services from Linke Electronics.


PCBA Process:


Our Factory Show:





Our Company is UL,ISO9001,ROHS and GJB9001B certified. 




Packing and Shipping:




1. How to Get a quotation?

For PCBs,please send us the Gerber File.For PCBA,please send us the Gerber file and BOM(Bill of Materials)

2. What is the MOQ?

No MOQ.1 pcs is ok.

3.What is the lead time?

For PCB orders,the lead time is 2 to 10 days.For PCBA orders,the lead time will be 15 to 30 days.

4.Will the boards be tested before shippment?

Yes,all PCBs will be tested by Flying Probe or E-test.For PCBA,we will have AOI,X-ray,and functional test


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