In the actual production process, OSP board is prone to surface color change, film thickness is uneven, film thickness is too poor (too thick or too thin) and so on. In the later stage of PCB manufacture, it is easy to appear the welding pad oxidation if the PCB is not stored and used properly, the tin on the pad is not good, it can not form the solid solder joint, the virtual welding and the solder is not full and so on. It is easy to produce double panel second surface and tin furnace welding by SMT, such as bad reflux welding, copper leakage of solder joint, appearance that can not meet the standard of IPC3, and high welding defect rate of tin furnace.
There are many factors that influence the bad welding of OSP surface treatment PCB.Such as the composition and quality of OSP solution, the thickness and uniformity of OSP film, the packaging and storage of OSP plate, the use and time control of SMT section, and the process parameters (such as steel mesh opening, etc.) .There is a close relationship between the temperature of the furnace and so on. The quality of OSP solution and the thickness and uniformity of OSP film are the prerequisites to ensure the welding quality. The welding defects caused by these PCB manufacturing problems are difficult or even unsolvable in the process of SMT production.
In order to improve and ensure good welding quality, PCB plant should strictly control the key process parameters of PCB manufacturing, and ensure the quality of OSP film and PCB production. After production, PCB should be packed and stored strictly according to the requirements of OSP board; SMT should be strictly controlled according to the time of use; The process parameters such as opening of stencils and oven temperature should be controlled and optimized, and perfect production process of OSP plate should be established.(Cheap Pcb Assembly)
Our Company is UL,ISO9001,ROHS and GJB9001B certified.
Packing and Shipping:
1. How to Get a quotation?
For PCBs,pls send us the Gerber File.For PCBA,pls send us the Gerber file and BOM(Bill of Materials)
2. What is the MOQ?
No MOQ.1 pcs is ok.
3.What is the lead time?
For PCB orders,the lead time is 2 to 10 days.For PCBA orders,the lead time will be 15 to 30 days.
4.Will the boards be tested before shippment?
Yes,all PCBs will be tested by Flying Probe or E-test.For PCBA,we will have AOI,X-ray,and functional test