Welding Defects Caused by Warpage
Circuit boards and components warp in the welding process, resulting in rosin joint, short circuit and other defects due to stress and deformation. Warpage is often caused by the temperature imbalance between the upper and lower parts of the circuit board. Large PCBs can also warp due to the weight of the board itself. Ordinary PBGA devices are about 0.5mm away from PCB. If the devices on PCB are large, the solder joints will be under stress for a long time as the PCB returns to its normal shape after cooling. If the device is raised by 0.1mm, it will be enough to lead to rosin joint and open circuit.(Printed Circuit Board)
Process of pcb manufacturing:
PCB Factory Show:
Our Company is UL,ISO9001,ROHS and GJB9001B certified.
Packing and Shipping:
1. How to Get a quotation?
For PCBs,pls send us the Gerber File.For PCBA,pls send us the Gerber file and BOM(Bill of Materials)
2. What is the MOQ?
No MOQ.1 pcs is ok.
3.What is the lead time?
For PCB orders,the lead time is 2 to 10 days.For PCBA orders,the lead time will be 15 to 30 days.
4.Will the boards be tested before shippment?
Yes,all PCBs will be tested by Flying Probe or E-test.For PCBA,we will have AOI,X-ray,and functional test